| High Precision Solder Paste Jet Dispensing Machine
The I.C.T Solder Paste Jet Dispensing Machine is engineered for micro-volume, high-speed, high-precision SMT production. It supports semiconductor packages, board mounting, LED back-end, Mini-LED, PC hard drives, ICs, and BGA applications. Linear motor drives, laser height measurement, and fast image processing combine to control glue, solder paste, and underfill accurately. Needle height compensation, substrate warpage detection, and automated path correction ensure consistent deposition. For dense or miniature PCB designs, this machine stabilizes material application while reducing manual intervention, improving throughput and repeatability in high-mix, high-precision SMT production environments .
| Feature of Solder Paste Jet Dispensing Machine
Transmission Structure System
The X/Y linear motor drive delivers fast, stable, and precise motion across the work area. Reciprocating accuracy is 3σ ±5μm (X, Y, Z axes) and dynamic accuracy is 3σ ±3μm (X/Y axes). Load-type gantry construction enhances stability at high speeds, ensuring reliable dot placement even for high-density boards or fine-pitch ICs. Motion precision here forms the foundation for repeatable solder paste deposition.
Function Configuration
The system adapts to real PCB conditions, adjusting to uneven surfaces and minor component shifts. Three-point PCB measurement calculates the working plane; needle height is compensated automatically. Dual cameras monitor underfill penetration during operation, and data feeds into subsequent dispensing adjustments. Engineers can configure platform layout, valve selection, and operational parameters to match high-viscosity or low-viscosity materials without disrupting production flow.
Vision Non Stop
Vision non-stop capability allows continuous high-speed inspection. The machine detects up to 100 chips per second, automatically correcting for position and height deviations, compensating path and glue volume simultaneously. Overlapping point calculations reduce excess material, enabling precise micro-dot application on ICs and BGAs without process interruption. It ensures the dispensing action remains synchronized with real-time board variations.
Configuration Options And Applications
Valves and nozzle types can be selected according to material: screw valves for high-viscosity glue or solder paste, jet valves for fluid materials. Minimum dot size reaches 110μm. Applications include semiconductor packages, PCB mounting, LED back-end, Mini-LED, and PC hard drives. This flexibility allows a single machine to serve multiple precise SMT dispensing operations, providing a stable platform for micro-volume deposition with consistent quality.
| Solder Paste Jet Dispensing Machine Specifications:
| I.C.T-HD330 | High Precision SMT PCB Dispensing System |
| Max PCB Size | 50*70~250*330mm |
| Drive | Linear motor |
| X / Y repeatability precision- 3 sigma | ±5μm |
| X / Y max speed | 1500mm/sec |
| Acceleration | 1.5G |
| Picture processing-digital camera -automaton | Repeatability | ±1μm |
| Precision | MAX: 0.03sec/point |
| Alignment | S |
| Chip master | S |
| Bad mark | S |
| Repeatability precision | S |
| Non-Stop CCD | S |
| Height measure system(Laser Type) | Repeatability precision | ±1μm |
| 0.1sec/point |
| Calibration | Robot-camera | S |
| Camera-z | S |
| Camera-needle | S |
| Needle-z | S |
| Simply monitor | Dispensing area (OK/NG) | S |
| Dispensing perimeter (OK/NG) | S |
| Underfill permeation auto-monitor | S |
| Bad mark inspection | S |
| Height inspection | S |
| AOI feedback | Dispensing volume feedback | S |
| Picture processing feedback | S |
| Height measure feedback | S |
| Needle cleaning | Air blow type | S |
| Vacuum type | S |
| Material discharge | S |
| Electronic scales | Accuracy | 0.1mg / 0.01mg |
| Feedback | OPTION |
| Heat unit(pre/main/after) | OPTION |
| Compressed air | 0.4-0.6 Mpa |
| Power | AC200V,3φ,20A |
| Dimension | 1300*1100*1380mm |
| Weight | 850kg |
* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice.
| PCBA Coating Line Equipment List
The machine works within I.C.T’s full coating and dispensing production line. Related equipment includes conformal coating machines, curing ovens (UV/IR), PCB conveyors, AOI inspection, and depaneling systems. Glue, solder paste, and underfill are applied accurately by the dispenser, coating machines protect broader PCB surfaces, and curing ovens finalize the material. AOI verifies results, depaneling separates finished boards. Together, these devices create a seamless production workflow for high-precision SMT PCB operations.
| Product Name | Purpose in PCBA Coating Line |
Coating Machine | Applies precise protective coatings to circuit boards for dustproof, waterproof, and explosion-proof protection. |
Curing Oven | Hardens coatings with IR or UV light, ensuring durable and strong protection. |
Conveyor | Transports circuit boards smoothly through the coating line for efficient processing. |
Loader and Unloader | Provides and stores PCB for the production line, ensuring smooth input and output. |
| Conformal coating AOI | Inspects coating quality and detects defects to ensure high standards. |
| Customer Success Video
In April 2026, I.C.T deployed an SMT production line for a Portuguese automotive electronics manufacturer. Engineers provided on-site installation, line adjustment, and operator training. The team explained machine operation, maintenance routines, and workflow integration for daily production. The customer praised both the equipment performance and the clarity of the training. Installation was efficient, and operators gained practical knowledge for reliable day-to-day line operation, confirming I.C.T’s commitment to supporting high-precision SMT processes.
| Service and Training Support
I.C.T delivers services covering the full SMT factory, not individual machines. Project planning includes PCB type, material selection, production targets, workshop layout, and expansion considerations. Post-delivery support includes installation, commissioning, operator training, maintenance guidance, and process optimization. Engineers help integrate dispensing, coating, curing, inspection, handling, and depaneling equipment into one stable line. For new facilities, support moves from layout planning to trial production. For existing lines, support improves process flow, line balance, and operational efficiency.
| What Our Customers Say
Customers note I.C.T’s involvement extends beyond equipment delivery. In full SMT projects, they assess machine stability, training quality, packing reliability, response time, and post-sales support. Engineers demonstrate operation clearly, helping operators understand processes quickly and avoid early mistakes. Export packaging ensures safe shipment. Questions arising during installation or production are answered promptly by coordinated sales and engineering teams, giving customers confidence during line startup, ramp-up, and ongoing operation.
| Certifications and Standards
I.C.T manages SMT factory projects with a structured quality system. The High Precision Solder Paste Jet Dispensing Machine is certified CE, RoHS, ISO9001, and covered by patents. Quality extends beyond certificates to include inspection, assembly verification, function testing, packing, shipment tracking, installation records, and after-sales support. Small pre-shipment issues are identified and corrected, reducing risk. For high-precision PCB dispensing, this ensures consistent, reliable process control across the factory.
| About I.C.T Company and Factory
I.C.T provides end-to-end electronics manufacturing solutions, covering SMT, DIP, coating, dispensing, assembly, robotics, and smart factory systems. With R&D, production, engineering, sales, and service teams in-house, I.C.T supports customers from planning to steady-state operation. The company has served customers in multiple countries with equipment supply, installation, training, and process improvement. Beyond machine delivery, I.C.T helps build new production lines from 0 to 1 and upgrade existing facilities from 1 to 10, ensuring scalable, reliable, and high-precision SMT PCB manufacturing systems.
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