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I.C.T-Lyra733N | Modular Design Hot Air SMT Reflow Oven

I.C.T Lyra Series Reflow Oven is made with Nitrogen Standard. Customer can add nitrogen at any time in future
I.C.T brings 26 years of experience in the SMT industry.
On-site installation and training Available. 24/7 Customer Service.
Highly Trained Experts. Accurate and economical. Vision guided DIY kit. Easy To Assemble. Open Source Software
  • I.C.T-Lyra733/733N

  • I.C.T

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I.C.T-Lyra733N | Modular Design Hot Air SMT Reflow Oven


Introduction


Advanced Reflow Oven for High-Precision SMT Soldering


The I.C.T Lyra733N is a next-generation reflow oven designed for high-speed, high-reliability SMT production lines. It features modular zones, precise hot air circulation, and intelligent control systems that ensure consistent and reliable soldering results across a wide range of PCB assemblies.

Whether you're manufacturing automotive electronics, LED drivers, or industrial control boards, the Lyra733N offers flexibility, accuracy, and long-term performance. With smart energy-saving technology and easy maintenance design, this reflow oven is an ideal choice for modern SMT factories.


Key Features of Lyra733N Reflow Oven


  • Modular design: Up to 10 heating zones for customised process control

  • Hot air convection system: Stable thermal profile and fast heat-up

  • Precision control: PID closed-loop system for temperature accuracy

  • Nitrogen-compatible option: For high-quality, oxide-free soldering

  • Smart diagnostics: Built-in alarms, energy tracking, and maintenance prompts

  • CE certified: Designed to meet European safety and environmental standards



Reflow Soldering Oven

SMT Reflow Soldering Oven

Reflow Oven Introduce

Reflow Oven Introduce

SMT Reflow Oven Introduce

SMT Reflow Oven Introduce


Lyra Series Reflow Soldering Oven

  • High effective flux management system

  • High stability nitrogen protection system

  • High performance cooling system

  • Support the CBS, Split Unit

Model Lyra 622/622N
Lyra 733/733N
Lyra 933/ 933N
Quantity of preheating zones
6 7 9
Quantity of peak zones
2 3 3
Max. soldering temperature
pre-heating zones 300 °C and peak zones350 °C
Quantity of cooling zones
2 2 3
Mesh Width
Standard 440mm( Option 560 & 680mm )
Rail Width
Single Rail: 50 - 460mm, Option: 50 - 686mm other Width on request. Dual Rail Standard: 50 - 290mm*2
Dimensions
5150*1400*1500mm
6250*1400*1500mm
6950*1400*1500mm
Weight
2600 kg
3000 kg
3400 kg

* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice.



Frequently Asked Questions (FAQ):



Q1: What products is this reflow oven suitable for?
A: The Lyra733N is widely used for automotive electronics, LED lighting boards, consumer electronics, and industrial automation PCBs.


Q2: Does the reflow oven support nitrogen for low-oxidation soldering?
A: Yes. The system is available with a nitrogen-ready closed environment for improved soldering quality.


Q3: Is the system easy to maintain?
A: Absolutely. The Lyra733N features modular heating zones, fast-cleaning parts, and automatic error detection for easy maintenance.



Need Help Choosing the Right Reflow Oven?

Let our SMT experts help you select the most suitable reflow oven for your production needs.
Get a free consultation or quick quote in 24 hours.

Contact Us Now >>>



FAQ:


Q: What is a reflow oven?

A: A reflow oven is a vital machine in electronics manufacturing. It is designed to heat and melt solder paste, allowing it to create secure connections between electronic components and printed circuit boards (PCBs) during the surface mount technology (SMT) assembly process.

 

Q: Why use a reflow oven?

A: Reflow ovens offer precise and consistent soldering, making them indispensable in electronics manufacturing. They ensure high-quality solder joints, compatibility with miniature components, and are essential for modern PCB assembly.

 

Q: What are the stages of reflow oven?

A: The reflow oven process typically consists of preheating, solder paste reflow, and cooling stages. Preheating gradually raises the temperature to activate the flux and remove moisture. The solder paste then reflows to create connections, followed by cooling to solidify the solder joints.

 

Q: What is the difference between reflow oven and wave soldering?

A: Reflow ovens are used for SMT assembly, heating solder paste to create precise connections. In contrast, wave soldering is employed for through-hole components, using a wave of molten solder to solder the bottom side of PCBs. Each method serves different assembly needs in electronics manufacturing.

 

I.C.T - Our Company


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About I.C.T: 


I.C.T is a leading provider of factory planning solution. We have 3 wholly-owned factories, providing professional consultation and services for global customers. We have more than 22 years of eletronic overall solutions. We not only provide a complete set of equipment, but also provide full range of technical support and services, and give customers more reasonable professional advice. We help many customersv to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are trustworthy.

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For SMT Factory Setup, We Can Do for You:

1.  We Provide Full SMT Solution for You

2.  We Provide Core Technology With Our Equipments

3.  We Provide The Most Professional Tech Service

4.  We Have Wealthy Experience on SMT Factory Setup

5.  We Can Solve Any Question About SMT


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