A practical comparison of inline and offline SMT inspection equipment: how throughput, coverage, board handling, floor space, repair loop, labour and total cost decide which configuration fits each checkpoint on your line.
A step-by-step SMT inspection plan for PCB assembly: assign one checkpoint to each failure mode, from solder paste inspection after the printer through AOI, X-ray, first article verification and final electrical test, with a defined action at every trigger.
A working map from defect risk to inspection method: assign solder paste inspection, AOI, X-ray, first article inspection and electrical test to the failure modes each can actually detect, at the cheapest point to act.
A practical framework for choosing SMT inspection equipment: classify defect risk, match SPI, AOI, X-ray and electrical test to process positions, check board and takt constraints, and validate with your own boards.
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