English  |
I.C.T-910
I.C.T
IC Autoamted Programming Machine
| Quantity: | |
|---|---|
The exercise system provides a dedicated environment for operator training, programming simulation, and process verification before production begins. Engineers can test different programming parameters and operation procedures without affecting actual manufacturing materials. This function helps shorten employee learning time, reduce setup errors, and improve production preparation efficiency. For semiconductor manufacturers handling multiple IC models, the exercise system provides a safer and more efficient way to establish stable programming procedures.
The feeder system automatically manages IC loading and transportation with accurate positioning control. It ensures a continuous supply of semiconductor components during programming operations while reducing manual handling requirements. The optimized feeding mechanism supports different IC package formats and improves production stability. By maintaining smooth material flow, the system helps manufacturers reduce interruptions, improve operating efficiency, and achieve consistent performance during long-duration automated programming processes.
The packaging system manages programmed IC components after completion of the programming process. Through automated transfer and organized packaging, it reduces unnecessary manual contact and protects components from handling damage. The flexible configuration supports different packaging requirements and production workflows. This allows semiconductor manufacturers to maintain better material organization, improve production efficiency, and ensure programmed components are ready for the next assembly stage.
The core programming system provides automated IC programming with intelligent software control and verification functions. It supports different semiconductor devices while maintaining stable communication and accurate programming results. Real-time monitoring allows operators to quickly identify abnormal conditions and adjust processes when needed. The Automated IC Programming Machine helps manufacturers improve programming reliability, reduce production errors, and maintain consistent quality during high-volume semiconductor processing.
| Item | Model | I.C.T-910 |
| Transmission system | Efficiency of the machine | Standard machine: Equipped with universal burner of Puro and other brands: 8 sets of 32-64sit burners: UPH 2000-3000PCS/H; Equipped with 204AP brand universal burner: 3 sets of 12sit burners: UPH1600-2200PCS/H |
| A small number of diverse modes: equipped with 3 sets of 204A burners, UPH 1600-1800PCS/H. | ||
| Packaging conversion mode: pallet to tape production capacity of 4000PCS/H (12mm tape products as an example) | ||
| Control precision | Precision servo screw drive, accuracy: X-axis ±0.015mm; Y-axis ±0.015mm; Z-axis ±0.03mm; P-axis ±0.03mm; U(θ)-axis ±0.15° | |
| Suitable package form | PLCC, JLCC , SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP, and so on. (Open Top adapters, some ICs need to be customized with special adapter consumables). | |
| Includes precision upper and bottom CCD positioning system. | ||
| Feeding and unloading device | Tray IN/ OUT | Supports automatic Tray feeding, can send 10 trays of JEDEC Tray products at the same time, and supports marking tray components after programming |
| Tube IN/ OUT | Support 4-tube IC electromagnetic vibration feeding | |
| Tape IN/ OUT | Electric feeder, supports 8-24mm self adhesive film or hot press packaging. | |
| Conversion of packaging methods | Different packages are converted to each other, Tray packed to Tape packed, Tape packed to Tray packed. | |
| Other | Nozzle | 4pcs |
| Camera | 2pcs (Component camera + Marking camera) | |
| Feeder station | 2pcs (8-24mm) | |
| Ion fan | 2pcs | |
| Power | Operating voltage: 190~240V/50Hz, 2.0KW | |
| Dimension | L1450*W860*H1450mm | |
| Weight | 700kg | |
* I.C.T keeps working on quality and performance,specifications and appearance may be updated without particular notice.
| SMT Line Equipment List
Building a competitive electronics factory requires more than individual machines; it requires a complete production strategy. I.C.T provides integrated SMT, DIP, and coating line solutions covering factory layout planning, equipment configuration, process connection, and technical support. From PCB assembly and soldering to inspection and protective coating, every production stage is designed to work together efficiently. This complete approach helps manufacturers improve productivity, reduce operational challenges, and establish reliable manufacturing capabilities for different electronic products.
| Product Name | Purpose in SMT Line |
|---|---|
| PCB Loader | Automatically loads bare PCBs to the line. |
| Solder Paste Printer | Prints solder paste on PCB pads accurately. |
| Pick and Place Machine | Mounts components onto PCBs precisely. |
| Reflow Oven | Melts solder to form solid joints. |
| AOI Machine | Inspects solder joints and placement defects. |
| SPI Machine | Checks solder paste height and quality. |
| Traceability Equipment | Records and tracks production data: Laser Marking Machine/Label Mounter/Inkjet Printer |
| SMT Cleaning Machine | Used for cleaning PCBs, stencils, fixtures, nozzles, etc. |
| Laser PCB Routing Machine | Cut the PCBA into the final product |
| Customer Success Video
Recently, I.C.T completed a full production line project for a customer in Kazakhstan focused on power supply manufacturing. The delivered solution included a fully automated SMT production line and a DIP insertion line. The SMT section consisted of a loader, full-auto printer, reflow oven, conveyors, and offline AOI machine. I.C.T engineers traveled to the customer’s factory to complete installation, machine setup, and operator training. After successful production preparation, the customer expressed appreciation for the machine quality, competitive price, and professional support provided by Andy and Billy.
| Service and Training Support
Efficient manufacturing depends on smooth cooperation between every production stage. I.C.T designs complete factory solutions by combining SMT, DIP, and coating processes into a unified workflow. Through professional production planning, equipment matching, and process optimization, manufacturers can improve line balance and reduce unnecessary production delays. This complete solution approach allows factories to achieve stable output, better resource utilization, and stronger production flexibility for changing market demands.
| Production Efficiency Improvement
Different industries have different production requirements, so I.C.T focuses on creating customized manufacturing solutions based on product types, capacity goals, and future expansion needs. By optimizing production flow and equipment coordination, factories can improve efficiency while maintaining flexibility for new products. A well-planned SMT, DIP, and coating system helps manufacturers reduce changeover difficulties, improve utilization rates, and build long-term competitive advantages.
| Certifications and Standards
Maintaining consistent product quality requires control throughout the complete manufacturing process. I.C.T integrates advanced production methods, inspection processes, and engineering experience to help customers achieve reliable output. From component preparation and PCB assembly to soldering and coating protection, each stage is carefully managed to reduce production variation. This systematic approach supports industries with strict quality requirements, including automotive, medical, industrial, and consumer electronics.
| About I.C.T Company and Factory
I.C.T specializes in complete electronics manufacturing solutions covering SMT, DIP, coating, automation, and intelligent factory systems. With professional engineering teams, independent production capability, and global project experience, I.C.T supports customers from factory planning and equipment selection to installation, training, and long-term technical service. Serving manufacturers worldwide, I.C.T helps companies build efficient, reliable, and scalable production systems for semiconductor, electronics, and industrial applications.
