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I.C.T-L8 | SMD Reflow Soldering Oven SMT Machine for SMT Line

8 Zones Professional reflow oven, soldering oven, SMD soldering machine, reflow machine, for PCB Reflow Soldering
PC+Siemens PLC control system
Number Of Heating Zones: Up8/Bottom8
Max.Width Of PCB: Single rail: 400mm; Mesh: 500mm
Transmission Agent: Chain + Mesh
  • I.C.T-L8

  • I.C.T

Availability:
Quantity:

I.C.T-L8 | SMD Reflow Soldering Oven SMT Machine for SMT Line


Introduction


L-series Reflow Oven

L Series SMD Reflow Soldering Oven


L series lead-free reflow oven I.C.T’s mature product after years of market testing.L Series Reflow oven has maintained a larger share of the market for many years. Its unparalleled heating performance and temperature control system meets the requirements of various welding processes, It is I.C.T’s crystallization of years technical research and development. 


L Series Lead-free reflow is high-end reflow products committed to keeping up with market demand to enhance customers competitiveness.Its new design concept fully meets the needs of increasingly diverse processes, And considering the future direction of the industry, entirely suitable for communications, automotive electronics, home appliances, computers and other consumer electronic products .


Feature



1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be more than 99.99%. 

2.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat.The effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± 1 ℃ambient temperature to a temperature stabilization .

3.Monitoring Software:Windows interface, traditional and simplified Chinese and English online free switch, and operator password management, easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault self-diagnosis, process monitoring, automatic generate and save process control documents, substrate transport dynamic display. 

4.Cooling System: new cooling zone, quick and easy adjustment, easily reach the cooling requirements of different slopes.

5.Temperature protection:I.C.T using third-party over-temperature protection, multiple layers protection to ensure safe operation. 


Transportation system of L Series SMD Reflow Soldering Oven:



Transport System of reflow oven


1. The transportation method of mesh belt + chain is compatible with most PCBs and can meet more needs; 

2. The overall segmented guide rail and multi-cantilever structure ensure the parallelism and stability of the guide rail; 

3. High-temperature resistant lubricating oil, standard computer-controlled filling cycle, no manual maintenance required; 

4. Independent frequency converter, imported Panasonic motor, computer closed-loop control of transmission speed, deviation within ±2%;


reflow oven Option dual rails


5. Option:dual rails with independent control of each rail’s speed; 

6. The special spring-type chain tensioning device automatically adjusts the chain tightness to ensure that the chain will not get stuck; 

7. Independent guide rail width adjustment, optional electric guide rail width adjustment, higher efficiency.


Heating System of L Series SMD Reflow Soldering Oven:



Heating System of reflow oven


1. Imported high-temperature-resistant long-axis motor, with independent inverter control of upper and lower temperature zones, supporting stepless speed regulation from 0 to 3000 speeds; 

2. Specially made long-life winding heater with high thermal efficiency and sensitivity and small thermal inertia; 

3. Efficiently accelerates the air duct to provide sufficient circulating air volume; 

4. The rectifier board is made of high-quality imported aluminum-zinc plate, which has thermal compensation and thermal recovery of PCB, high thermal efficiency and better uniformity;


PID+SSR temperature control method

5. PID+SSR temperature control method, the temperature control accuracy reaches ±1℃ 

6. Each zone is independently controlled, and the PID+SSR temperature control method can better meet different temperature curves.


More information about Cleaning System, Nitrogen protection system, Cooling System and  Control System, please contact us >>


Model

L8

L10

Dimension (L*W*H)mm

5125x1430x1530

5805x1430x1530

Weight

Approx. 2100KG

Approx. 2315KG

Number Of Heating Zones

Up8/Bottom8

Up10/Bottom10

Length Of Heating Zones

3110mm

3892mm

Rail Width Adjustment

Manual adjustment (Option: Automatic)

Exhaust Volume

10M3/min*2 Exhausts

Control System

PLC+Computer

Temperature Control Method

PID + SSR

Transmission Agent

Chain + Mesh

Electric Supply Required

5 Wire System 3P, N, PE 380 VAC ± 5%, 50 Hz. Other voltages upon request

Power For Warm Up

64KW

80KW

Power Consumption

10KW

12KW

Warming Time

Approx.25 minute

Temp. Setting Range

Room Temp.-- 300°C

Conveyor Height

900+/-20mm

Conveyor Speed Range

300~2000mm/mi

Fixed Rail Side

Front Fixed (Option:Rear Fixed)

Cooling Method

Forced-Air Motor and fan (Standard)

* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice.


FAQ:


Q: What is reflow technique?

A: Reflow soldering is a fundamental technique in electronics assembly. It involves heating solder paste to a controlled temperature, allowing it to melt and form secure electrical connections between components and printed circuit boards (PCBs) during the surface mount technology (SMT) process.

 

Q: Why do you use flux when soldering?

A: Flux is used in soldering to remove oxides, contaminants, and promote wetting of the solder. It ensures a clean, reliable solder joint by facilitating the flow of molten solder and preventing defects like solder bridges or cold joints.

 

Q: Why is it called reflow soldering?

A: Reflow soldering gets its name from the process of "reflowing" or melting the solder paste. During reflow, solder paste transitions from a solid to a liquid state, forming precise and reliable connections between components and PCBs.

 

Q: How many times can you reflow a PCB?

A: Reflowing a PCB multiple times is generally not recommended. Each reflow cycle can subject components to thermal stress and potentially affect solder joint integrity. Minimizing the number of reflows helps ensure the reliability of electronic assemblies.


I.C.T - Our Company


pcb assembly line machine

About I.C.T: 


I.C.T is a leading provider of factory planning solution. We have 3 wholly-owned factories, providing professional consultation and services for global customers. We have more than 22 years of eletronic overall solutions. We not only provide a complete set of equipment, but also provide full range of technical support and services, and give customers more reasonable professional advice. We help many customersv to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are trustworthy.

SMT line


Exhibition


SMT assembly line

For SMT Factory Setup, We Can Do for You:

1.  We Provide Full SMT Solution for You

2.  We Provide Core Technology With Our Equipments

3.  We Provide The Most Professional Tech Service

4.  We Have Wealthy Experience on SMT Factory Setup

5.  We Can Solve Any Question About SMT


pcb assembly line


smt machines pcb assembly line

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