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I.C.T-LV733
I.C.T
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| Advanced Inline Vacuum Reflow Technology
Inline Reflow Soldering under Vacuum is designed for electronics manufacturers who need consistent soldering performance across high-density PCBs. By combining vacuum control with precise thermal profiles, this system minimizes solder voids and ensures joint integrity in complex assemblies.
The oven integrates continuous conveyor flow to maintain steady production while preserving the thermal and vacuum environment. It is ideal for SMT vacuum reflow soldering equipment lines where stability and repeatable results are crucial. The design supports high-volume SMD production, reducing defects while maintaining process efficiency for industrial PCB assembly lines.
| Feature
The vacuum zone operates during the critical solder melting phase, providing an actively managed pressure environment. Trapped gases within molten solder are gently extracted, reducing void formation without disrupting PCB positioning. This approach enhances solder joint reliability for dense BGAs and multi-layer boards. By managing vacuum timing and intensity, the process prevents micro-defects and supports high-consistency output, making it highly suitable for inline reflow soldering operations where repeatable quality across batches is required.
The heating system applies staged convection zones with independent control to maintain even temperature across the entire PCB surface. Airflow and energy distribution are balanced to prevent hotspots and thermal deviations, ensuring solder melts uniformly. This approach reduces the occurrence of cold joints or uneven reflow and improves overall reliability for complex SMT assemblies. The system adapts dynamically to board size and component density, supporting efficient inline reflow soldering under vacuum and achieving consistent soldering quality.
The operator interface provides comprehensive control over vacuum, temperature, and conveyor operations. Rather than adjusting parameters individually, operators can manage integrated process recipes that define the entire reflow sequence. Real-time monitoring, fault detection, and recipe recall ensure consistent performance across multiple production runs. This design minimizes human error and improves throughput while maintaining process reproducibility, supporting high-volume SMD production and ensuring optimal solder joint formation in vacuum reflow soldering oven machine operations.
| Specification
| LV Series Vacuum Reflow Oven | I.C.T-LV623 | I.C.T-LV733 |
Dimensions | L6405*W1695*H1630 | L7164*W1695*H1630 |
Weight | 3000 kg | 3500 kg |
| Number of heating zone | Top 8 /Bottom 8 | Top 10 /Bottom 0 |
| Length of heating zone | 3110mm | 3892mm |
| Number of cooling zone | Top 3 /Bottom 3 | Top 3 /Bottom 3 |
| Exhaust volume requiement | 11m³/min*2 | 12m³/min*2 |
| Power | 3phase, N,PE;AC380V50/60HZ | |
| Normal power consumption | 10KW | 12KW |
| Temperature control Mode | PID close loop cont+SSR driving | |
| Conveyor system | ||
| Rails structure | Three-stage independent | |
| Max width of PCB | 150*150MM-400*400MM | |
| Range of rail width | 50mm-400mm | |
| Components height | Up 25mm/down 25mm | |
| Conveyor fixed type | Front end fixing | |
| PCB conveyor direction | Guide rail plus chain | |
| Conveyor height | 900±20mm | |
| Cooling system | ||
| Cooling method | Forced air cooling (vacuum reflow soldering) Chiller cooling (vacuum nitrogen reflow soldering) | |
| Nitrogen System | Nitrogen confined structures and pipelines, nitrogen flow meters, chillers | |
As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here. | ||
* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice. If different, please follow the new list.
| SMT Line Equipment List
Our SMT assembly line features advanced equipment for efficient and precise PCB assembly. The fully automated SMT line includes a loader, an auto printer for accurate solder paste application, a pick-and-place machine for precise component placement, a reflow oven for reliable soldering, and an AOI system for thorough defect inspection. This High Quality PCBA Production Line ensures smooth operation, high reliability, and low-cost SMT assembly, meeting diverse industry requirements.
| Customer Success Video
Full SMT & DIP line deployment
A large electronics manufacturing facility in Uzbekistan implemented a complete SMT and DIP production solution for motherboard, SSD, and memory module production. The project included full system integration from equipment installation to production validation.
The SMT line consisted of printing systems, multiple placement machines, inspection systems, PCB handling systems, and reflow processing equipment. The DIP line included manual insertion systems, odd-form insertion machines, and wave soldering systems.
I.C.T engineers provided full technical support during installation, debugging, and production ramp-up. After commissioning, the customer confirmed stable system operation and consistent production output across all manufacturing stages.
| Global Full-Line Support
Comprehensive engineering support for production efficiency
I.C.T offers technical assistance for Inline Reflow Soldering under Vacuum, including on-site installation, operator training, and process optimization. Engineers help customers fine-tune vacuum and temperature parameters to ensure consistent soldering results. Training focuses on understanding how vacuum, heat, and conveyor coordination affect solder quality, enabling operators to manage SMT production lines efficiently and reduce production variability.
| Customer Praise
Reliable performance across extended production runs
Customers highlight the system’s ability to maintain stable solder quality over long cycles and repeated batches. The vacuum-assisted reflow process ensures joint reliability even in high-density PCB assemblies. Engineering support, fast response, and careful packaging are consistently praised, enabling smooth setup, operation, and global delivery.
| Our Certification
Compliance with global industrial standards
Inline Reflow Soldering under Vacuum is manufactured under CE, RoHS, ISO9001, and relevant SMT process certifications. Each unit undergoes thorough factory testing to ensure reliable performance in vacuum reflow soldering oven machine environments worldwide. This guarantees safe operation and consistent solder quality for industrial electronics manufacturing.
| About I.C.T and Factory
Global provider of SMT manufacturing solutions
I.C.T develops complete SMT, DIP, and coating line solutions with in-house R&D, engineering, and production capabilities. Serving over 80 countries, the company supports industrial electronics manufacturing with robust process knowledge, strict quality control, and reliable long-term equipment performance for high-density PCB assembly and vacuum reflow soldering system applications.
