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I.C.T | SMT Convection Reflow Solder Oven BGA with Pump and Chiller

 
Stable convection reflow system for high-end BGA soldering applications
a. Advanced vacuum-assisted BGA soldering process
b. Stable SMT convection heating performance
c. Integrated pump and chiller cooling system
d. Smart PLC + PC control interface
e. Low void soldering reliability improvement
f. Compatible SMT reflow oven PCB oven line
g. Global engineering technical support
  • I.C.T-LV733

  • I.C.T

Availability:
Quantity:

Vacuum BGA Reflow Oven – High Reliability SMT Soldering System

PCB Loader 104


| Precision Vacuum Convection Reflow Solution

The Vacuum BGA reflow oven is designed for high-reliability SMT soldering processes, especially for BGA and complex PCB assemblies. It combines convection heating with vacuum technology to improve solder joint quality and reduce internal voids. This system is widely used in advanced SMT reflow oven PCB oven production environments where stability and precision are critical.

The machine integrates a pump and chiller system to maintain stable vacuum pressure and controlled thermal balance during soldering. With intelligent PLC control and optimized airflow design, it ensures consistent temperature distribution and strong process repeatability. It is suitable for high-performance electronics manufacturing requiring reliable solder reflow in oven processes across mass production lines.


| Feature


Vacuum Zone – Ultra Low Void Soldering Control

Feature Reflow Oven 01

The vacuum zone removes trapped gas during peak solder melting, reducing void formation inside BGA joints. The integrated pump system ensures stable pressure control throughout the process. This improves electrical conductivity and mechanical strength, making it suitable for high-end SMT reflow oven PCB oven production with strict quality requirements.


Heating System – Stable Multi-Zone Thermal Control

Feature Reflow Oven 02

The heating system uses advanced convection airflow to ensure uniform temperature across all PCB areas. Multi-zone control maintains stable thermal curves and prevents overheating or uneven soldering. This improves consistency in SMT convection reflow oven SMT applications and supports complex board structures with high component density.


Operator System – Smart Industrial Control Platform

Feature Reflow Oven 03

The operator system uses a simple PLC + PC interface for full process control. Users can easily adjust vacuum levels, temperature profiles, and cooling parameters. Recipe storage, real-time monitoring, and fault alerts improve production efficiency and reduce operator errors in solder reflow in oven manufacturing environments.



| Specification

LV Series Vacuum Reflow Oven

I.C.T-LV623

I.C.T-LV733

Dimensions

L6405*W1695*H1630 L7164*W1695*H1630

Weight

3000 kg

3500 kg
Number of heating zone Top 8 /Bottom 8 Top 10 /Bottom 0
Length of heating zone 3110mm 3892mm
Number of cooling zone Top 3 /Bottom 3 Top 3 /Bottom 3
Exhaust volume requiement 11m³/min*2 12m³/min*2
Power 3phase, N,PE;AC380V50/60HZ
Normal power consumption 10KW 12KW
Temperature control Mode PID close loop cont+SSR driving
Conveyor system
Rails structure Three-stage independent
Max width of PCB 150*150MM-400*400MM
Range of rail width 50mm-400mm
Components height Up 25mm/down 25mm
Conveyor fixed type Front end fixing
PCB conveyor direction Guide rail plus chain
Conveyor height 900±20mm
Cooling system
Cooling method

Forced air cooling (vacuum reflow soldering)

Chiller cooling (vacuum nitrogen reflow soldering)

Nitrogen System Nitrogen confined structures and pipelines, nitrogen flow meters, chillers

As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here.

* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice. If different, please follow the new list.


| SMT Line Equipment List

SMT LINE


Our SMT assembly line features advanced equipment for efficient and precise PCB assembly. The fully automated SMT line includes a loader, an auto printer for accurate solder paste application, a pick-and-place machine for precise component placement, a reflow oven for reliable soldering, and an AOI system for thorough defect inspection. This High Quality PCBA Production Line ensures smooth operation, high reliability, and low-cost SMT assembly, meeting diverse industry requirements.


1 SMT Line with SMT Machine 02


Product Name Purpose in SMT Line
PCB loader unloader Automatically loads bare PCBs to the line.
SMT stencil printing machine Prints solder paste on PCB pads accurately.
Yamaha SMT machine Mounts components onto PCBs precisely.
SMT Reflow Oven Melts solder to form solid joints.
Automated optical inspection equipment Inspects solder joints and placement defects.
Solder paste inspection machine Checks solder paste height and quality.
Traceability Equipment Records and tracks production data: Laser Marking Machine/Label Mounter/Inkjet Printer


| Customer Success Video


Complete SMT & DIP Line Deployment

I.C.T provided a full SMT and DIP production solution for a large electronics factory in Uzbekistan. The customer manufactures computer motherboards, SSD storage devices, and memory modules with high production demand.

The SMT line included stencil printing equipment, four placement machines, SPI, AOI systems, PCB handling systems, and reflow oven units. The DIP line included manual insertion systems, JUKI odd-form insertion machines, and wave soldering systems.

I.C.T engineers supported full installation, debugging, and production training. After system commissioning, the customer confirmed stable operation, strong equipment reliability, and excellent technical support performance.




| Global Full-Line Support


Global Engineering Support System

I.C.T provides complete technical support for Vacuum BGA reflow oven systems, including installation, process training, and production optimization. Engineers assist both on-site and remotely to ensure smooth factory startup and stable SMT production performance.

Training covers temperature profile setup, vacuum operation control, maintenance procedures, and troubleshooting methods. This helps operators manage SMT reflow oven PCB oven systems efficiently and reduce production downtime.


SMT Solder Paste Printer 206


| Customer Praise


Strong Global Manufacturing Trust

Customers recognize I.C.T equipment for stable performance, high soldering quality, and reliable long-term operation. The Vacuum BGA reflow oven is especially praised for its consistent void reduction results and easy operation interface.

Customers also highlight fast technical response, professional installation service, and secure packaging during shipment. These advantages help factories maintain stable SMT production and improve overall manufacturing efficiency.


好评1


| Our Certification


International Industrial Compliance

The Vacuum BGA reflow oven is manufactured under strict international standards including CE, RoHS, ISO9001, and patented SMT process technologies. These certifications ensure safe operation, stable performance, and global compliance.

Each machine undergoes strict factory testing before delivery to guarantee reliability in high-demand SMT production environments worldwide.


证书1



| About I.C.T and Factory


Global SMT Manufacturing Partner

I.C.T is a global provider of SMT and electronics manufacturing solutions with strong R&D, production, and engineering service capabilities. The company serves customers in more than 80 countries worldwide.

With advanced manufacturing systems and experienced engineering teams, I.C.T delivers complete SMT, DIP, and coating production line solutions. Our strict quality control ensures stable equipment performance and long-term reliability for global electronics manufacturing industries.

工厂1

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