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I.C.T-LV733
I.C.T
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| Lead-Free High Vacuum Soldering Solution
The Vacuum Reflow Oven Machine is engineered to maintain consistent solder quality across complex PCB assemblies. By combining high vacuum control with carefully profiled thermal zones, the system reduces solder voids and enhances joint integrity. It supports lead-free processes while maintaining continuous production flow, making it ideal for high-volume SMT vacuum reflow oven environments.
Its design integrates conveyor transport and intelligent control to stabilize temperature and vacuum levels throughout each reflow cycle. This ensures uniform soldering for dense component layouts and multi-layer boards, delivering reproducible results and improved reliability across Reflow Soldering Oven Machine lines.
| Feature
The vacuum zone actively manages gas removal during solder melting, minimizing micro-void formation. The system ensures consistent pressure throughout the PCB surface without disturbing board placement, which is critical for dense BGA and fine-pitch components. By controlling the timing and intensity of vacuum application, the process improves both mechanical strength and electrical reliability, producing stable and repeatable results in lead-free high vacuum reflow oven operations.
The heating system divides energy into independently controlled zones to ensure uniform temperature distribution. Airflow adjustments prevent hotspots, ensuring consistent melting across all components. This staged thermal approach reduces cold solder joints and uneven reflow issues. The design adapts dynamically to various board sizes and component densities, maintaining high soldering quality across continuous vacuum reflow oven machine production cycles.
The operator interface consolidates vacuum, heating, and conveyor controls into unified process recipes. Operators can adjust thermal profiles, vacuum levels, and transfer speeds through a centralized platform. Real-time monitoring and automatic alerts help maintain consistent soldering quality and reduce human error. This approach ensures reproducible results across multiple production shifts, enabling efficient operation of SMT vacuum reflow oven lines and lead-free reflow oven processes.
| Specification
| LV Series Vacuum Reflow Oven | I.C.T-LV623 | I.C.T-LV733 |
Dimensions | L6405*W1695*H1630 | L7164*W1695*H1630 |
Weight | 3000 kg | 3500 kg |
| Number of heating zone | Top 8 /Bottom 8 | Top 10 /Bottom 0 |
| Length of heating zone | 3110mm | 3892mm |
| Number of cooling zone | Top 3 /Bottom 3 | Top 3 /Bottom 3 |
| Exhaust volume requiement | 11m³/min*2 | 12m³/min*2 |
| Power | 3phase, N,PE;AC380V50/60HZ | |
| Normal power consumption | 10KW | 12KW |
| Temperature control Mode | PID close loop cont+SSR driving | |
| Conveyor system | ||
| Rails structure | Three-stage independent | |
| Max width of PCB | 150*150MM-400*400MM | |
| Range of rail width | 50mm-400mm | |
| Components height | Up 25mm/down 25mm | |
| Conveyor fixed type | Front end fixing | |
| PCB conveyor direction | Guide rail plus chain | |
| Conveyor height | 900±20mm | |
| Cooling system | ||
| Cooling method | Forced air cooling (vacuum reflow soldering) Chiller cooling (vacuum nitrogen reflow soldering) | |
| Nitrogen System | Nitrogen confined structures and pipelines, nitrogen flow meters, chillers | |
As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here. | ||
* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice. If different, please follow the new list.
| SMT Line Equipment List
Our SMT assembly line features advanced equipment for efficient and precise PCB assembly. The fully automated SMT line includes a loader, an auto printer for accurate solder paste application, a pick-and-place machine for precise component placement, a reflow oven for reliable soldering, and an AOI system for thorough defect inspection. This High Quality PCBA Production Line ensures smooth operation, high reliability, and low-cost SMT assembly, meeting diverse industry requirements.
| Customer Success Video
Full SMT & DIP line deployment
A large electronics manufacturing facility in Uzbekistan implemented a complete SMT and DIP production solution for motherboard, SSD, and memory module production. The project included full system integration from equipment installation to production validation.
The SMT line consisted of printing systems, multiple placement machines, inspection systems, PCB handling systems, and reflow processing equipment. The DIP line included manual insertion systems, odd-form insertion machines, and wave soldering systems.
I.C.T engineers provided full technical support during installation, debugging, and production ramp-up. After commissioning, the customer confirmed stable system operation and consistent production output across all manufacturing stages.
| Global Full-Line Support
Comprehensive technical support for lead-free vacuum production
I.C.T provides installation, training, and process optimization for Vacuum Reflow Oven Machine systems. Engineers assist in adjusting vacuum levels, thermal profiles, and conveyor speed to achieve uniform soldering. Training emphasizes the relationship between vacuum, heat, and board movement, enabling operators to maintain stable SMT line performance and minimize defects across multiple production runs.
| Customer Praise
High reliability and consistent production output
Customers report stable soldering quality throughout long production cycles, even with dense component layouts. The vacuum-assisted lead-free process reduces voids, improving reliability. Professional installation, prompt engineering support, and secure shipping are frequently praised, supporting continuous SMT vacuum reflow oven machine operation.
| Our Certification
Compliance with international manufacturing standards
The Vacuum Reflow Oven Machine is manufactured under CE, RoHS, ISO9001, and relevant SMT process certifications. Each unit undergoes strict factory testing to ensure stable operation and reproducible results for lead-free high vacuum reflow oven and SMT vacuum reflow oven production environments worldwide.
| About I.C.T and Factory
Global SMT equipment and line solutions provider
I.C.T provides end-to-end SMT, DIP, and coating line solutions with in-house R&D, production, and engineering support. Serving over 80 countries, the company delivers reliable and stable systems for industrial electronics production, enabling high-quality PCB assembly and reproducible results for vacuum reflow soldering oven machine operations.
