English Views: 0 Author: Site Editor Publish Time: 2022-04-27 Origin: Site
Lyra Reflow Oven is one of the most common soldering technologies in modern automated electronics manufacturing. The main technical point of Lyra Reflow Oven is temperature control. Therefore, accurate measurement and control of reflow soldering temperature and humidity is one of the ways to ensure soldering quality and reduce defects. key point. So what are the technical characteristics of temperature and humidity sensors that play an important role in Lyra Reflow Oven technology?
This is the content list:
l What is the principle of Lyra Reflow Oven's temperature control?
l The necessity of Lyra Reflow Oven to control the temperature.
l Precautions for the temperature and humidity sensor in Lyra Reflow Oven.
Lyra Reflow Oven is a soft soldering that realizes the mechanical or electrical connection between the solder ends or pins of surface mount components and the printed board pads by remelting the paste solder pre-allocated on the printed board pads. . This kind of Lyra Reflow Oven has a heating circuit inside, which heats air or nitrogen to a high enough temperature and blows it to the circuit board where the component is already attached, so that the solder on both sides of the component is melted and then bonded to the motherboard. The advantage of the Lyra Reflow Oven temperature and humidity sensor is that the temperature is easy to control, oxidation can be avoided during the welding process, and the manufacturing cost is easier to control.
Lyra Reflow Oven temperature and humidity sensor is a kind of information detection device, which can convert the sensed measurement information into electrical signals or other signals according to a certain rule. In addition, during the heating process of Lyra Reflow Oven soldering, low humidity environmental conditions will cause the solvent in the solder paste to evaporate too fast, which "drying" the solder paste. This will shorten the time of the entire melting process of the solder, and ultimately result in the failure to "release" enough solder paste during Lyra Reflow Oven reflow. Therefore, not only the pins of the components that need to be soldered cannot obtain sufficient solder paste, but also the reflow process cannot occur directly.
The humidity of the Lyra Reflow Oven environment should not be too high, otherwise the solder paste will absorb moisture from the air and reduce the degree of adhesion, which will directly affect the formation of the solder ball during reflow. When the temperature of Lyra Reflow Oven is too high, it will also cause a similar effect, which greatly increases the probability of tailing and bridging. In order to avoid the occurrence of the above situation, the temperature and humidity sensor of Lyra Reflow Oven is used to measure and control. It is more appropriate to maintain the relative humidity at 40% to 60% at an ambient temperature of 20 to 25°C.
