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I.C.T-LV733
I.C.T
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| High-Stability Vacuum Reflow Oven for SMT
The Vacuum Reflow Oven SMT is engineered for high-density PCB assemblies requiring consistent lead-free soldering performance. Its wide 450mm conveyor allows seamless board transport through controlled vacuum and thermal environments. By combining multi-zone heating with vacuum-assisted soldering, the system minimizes solder voids and ensures reproducible joint integrity across SMD components.
This oven supports conveyor-based SMT lines where high throughput and stable thermal profiles are critical. It adapts to varying PCB sizes and component densities, maintaining uniform solder flow and reliability. With intelligent PLC control, the system balances vacuum pressure and heating parameters to achieve repeatable results, reducing defects and improving overall process efficiency in industrial SMT production.
| Feature
The vacuum zone actively extracts trapped gases from molten solder during peak heating stages. Controlled pressure reduction ensures that micro-voids are minimized, while maintaining PCB stability on the conveyor. This system is particularly effective for dense LED boards or multi-layer PCBs, where traditional reflow ovens might allow gas entrapment. By continuously monitoring vacuum levels and adapting extraction rates, the oven provides uniform solder joint formation. This leads to higher reliability and repeatable results in lead-free SMT production cycles, addressing common challenges in conveyor reflow oven LED soldering operations.
The heating system distributes energy across four independently managed zones to maintain consistent temperature along the 450mm conveyor. Each zone’s airflow and thermal output are carefully tuned to prevent hotspots and cold regions, ensuring solder melts evenly across the board. This approach minimizes defects such as tombstoning or insufficient solder wetting. The multi-zone configuration adapts dynamically to board thickness and component density, supporting long-run production stability in vacuum reflow oven SMT operations. By controlling thermal profiles precisely, it guarantees high-quality soldering across different PCB types and production batches.
The operator interface is designed to allow full management of vacuum, heating, and conveyor parameters through a unified PLC platform. Operators can create, store, and recall process recipes that define the complete reflow cycle, including vacuum timing, temperature curves, and conveyor speed. Real-time monitoring and automated fault detection reduce human error and improve production consistency. By integrating all key process variables into one interface, the system ensures reproducible solder quality across multiple shifts. Operators can adjust parameters without disrupting ongoing production, supporting high-efficiency SMT vacuum reflow oven and conveyor reflow oven LED soldering operations.
| Specification
| LV Series Vacuum Reflow Oven | I.C.T-LV623 | I.C.T-LV733 |
Dimensions | L6405*W1695*H1630 | L7164*W1695*H1630 |
Weight | 3000 kg | 3500 kg |
| Number of heating zone | Top 8 /Bottom 8 | Top 10 /Bottom 0 |
| Length of heating zone | 3110mm | 3892mm |
| Number of cooling zone | Top 3 /Bottom 3 | Top 3 /Bottom 3 |
| Exhaust volume requiement | 11m³/min*2 | 12m³/min*2 |
| Power | 3phase, N,PE;AC380V50/60HZ | |
| Normal power consumption | 10KW | 12KW |
| Temperature control Mode | PID close loop cont+SSR driving | |
| Conveyor system | ||
| Rails structure | Three-stage independent | |
| Max width of PCB | 150*150MM-400*400MM | |
| Range of rail width | 50mm-400mm | |
| Components height | Up 25mm/down 25mm | |
| Conveyor fixed type | Front end fixing | |
| PCB conveyor direction | Guide rail plus chain | |
| Conveyor height | 900±20mm | |
| Cooling system | ||
| Cooling method | Forced air cooling (vacuum reflow soldering) Chiller cooling (vacuum nitrogen reflow soldering) | |
| Nitrogen System | Nitrogen confined structures and pipelines, nitrogen flow meters, chillers | |
As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here. | ||
* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice. If different, please follow the new list.
| SMT Line Equipment List
Our SMT assembly line features advanced equipment for efficient and precise PCB assembly. The fully automated SMT line includes a loader, an auto printer for accurate solder paste application, a pick-and-place machine for precise component placement, a reflow oven for reliable soldering, and an AOI system for thorough defect inspection. This High Quality PCBA Production Line ensures smooth operation, high reliability, and low-cost SMT assembly, meeting diverse industry requirements.
| Customer Success Video
Full SMT & DIP line deployment
A large electronics manufacturing facility in Uzbekistan implemented a complete SMT and DIP production solution for motherboard, SSD, and memory module production. The project included full system integration from equipment installation to production validation.
The SMT line consisted of printing systems, multiple placement machines, inspection systems, PCB handling systems, and reflow processing equipment. The DIP line included manual insertion systems, odd-form insertion machines, and wave soldering systems.
I.C.T engineers provided full technical support during installation, debugging, and production ramp-up. After commissioning, the customer confirmed stable system operation and consistent production output across all manufacturing stages.
| Global Full-Line Support
Comprehensive process and technical support
I.C.T provides installation guidance, operator training, and process optimization for the Vacuum Reflow Oven SMT. Engineers help define vacuum and thermal parameters for optimal soldering, focusing on how multi-zone heating interacts with the conveyor and vacuum stages. Training emphasizes real production scenarios to ensure operators understand the relationship between vacuum levels, temperature profiles, and PCB handling, improving line efficiency and reducing defect rates in lead-free soldering processes.
| Customer Praise
Reliable performance under high-volume production
Customers report that the Vacuum Reflow Oven SMT maintains uniform solder quality even in extended production runs with dense PCBs. The wide 450mm conveyor and vacuum-assisted lead-free process help minimize defects. Fast technical support, professional installation, and secure packaging are consistently praised, ensuring smooth operation for SMT soldering machine lead and conveyor-based reflow oven LED soldering lines.
| Our Certification
International quality and safety compliance
The Vacuum Reflow Oven SMT is manufactured under CE, RoHS, ISO9001, and related SMT process certifications. Every unit is factory-tested under simulated production conditions to guarantee reliable operation in vacuum reflow soldering oven machine and lead-free reflow oven environments, ensuring safety, performance, and reproducibility.
| About I.C.T and Factory
Global provider of SMT manufacturing solutions
I.C.T develops complete SMT, DIP, and coating production line solutions with in-house R&D, manufacturing, and engineering support. Serving over 80 countries, the company ensures stable equipment performance and long-term reliability, supporting high-volume PCB assembly and efficient inline vacuum reflow soldering processes.
