English  |
I.C.T-BLD600
I.C.T
| Quantity: | |
|---|---|
Features:
1. It is mainly used for semiconductor packaging and testing, washing the front end of the line body, and transferring the board to the lower computer equipment through the storage method of the clip frame, with automatic feeding function.
2. The control system adopts PLC control.
3. The operation interface adopts touch screen.
4. Lifting and translation are controlled by servo motor, and the lifting and shifting distance can be set arbitrarily.
5. The board feeding method adopts the stepper motor method.
6. The frame changing method adopts the platform multi-frame storage method, which has the function of single-frame
feeding and multi-frame feeding at the same time.
7. The positioning method of the mechanical card-type bin can be adjusted arbitrarily for bins of different sizes. 8. Equipped with standard SMEMA communication port, which can communicate with other automation equipment.
Advanced SMT Loader & UnLoader for Semiconductor
| Model | I.C.T-BLD600 | I.C.T-BUL600 |
| Board size (mm) | 80*50~330*120 | 80*50~330*120 |
| Transmission height (mm) | 900±20 | 900±20 |
| PCB Loading time | 6-16 sec | 6-16 sec |
| Magazine size | 80*50*100-300*150*400 | 80*50*100-300*150*400 |
| PCB thickness | 0.2-2.0mm | 0.2-2.0mm |
| Transmission direction | L to R/R to L | L to R/R to L |
| Compressed air pressure | 0.4~0.6Mpa | 0.4~0.6Mpa |
| Power | AC220V±10V, 50/60HZ 450W | AC220V±10V, 50/60HZ 450W |
| Machine size | 1000х1100х1300 mm | 1000х1100х1300 mm |
| Machine weight | 245KG | 245KG |
FAQ
Advanced Platform Loader for Semiconductor, Advanced Platform Loader for Semiconductor, Advanced Platform Loader for Semiconductor
Features:
1. It is mainly used for semiconductor packaging and testing, washing the front end of the line body, and transferring the board to the lower computer equipment through the storage method of the clip frame, with automatic feeding function.
2. The control system adopts PLC control.
3. The operation interface adopts touch screen.
4. Lifting and translation are controlled by servo motor, and the lifting and shifting distance can be set arbitrarily.
5. The board feeding method adopts the stepper motor method.
6. The frame changing method adopts the platform multi-frame storage method, which has the function of single-frame
feeding and multi-frame feeding at the same time.
7. The positioning method of the mechanical card-type bin can be adjusted arbitrarily for bins of different sizes. 8. Equipped with standard SMEMA communication port, which can communicate with other automation equipment.
Advanced SMT Loader & UnLoader for Semiconductor
| Model | I.C.T-BLD600 | I.C.T-BUL600 |
| Board size (mm) | 80*50~330*120 | 80*50~330*120 |
| Transmission height (mm) | 900±20 | 900±20 |
| PCB Loading time | 6-16 sec | 6-16 sec |
| Magazine size | 80*50*100-300*150*400 | 80*50*100-300*150*400 |
| PCB thickness | 0.2-2.0mm | 0.2-2.0mm |
| Transmission direction | L to R/R to L | L to R/R to L |
| Compressed air pressure | 0.4~0.6Mpa | 0.4~0.6Mpa |
| Power | AC220V±10V, 50/60HZ 450W | AC220V±10V, 50/60HZ 450W |
| Machine size | 1000х1100х1300 mm | 1000х1100х1300 mm |
| Machine weight | 245KG | 245KG |
FAQ
Advanced Platform Loader for Semiconductor, Advanced Platform Loader for Semiconductor, Advanced Platform Loader for Semiconductor
