The On-line Glue Potting Line delivers precise, automated potting of PCBA assemblies in high-volume production. Each station applies glue evenly, maintaining consistent coverage across components of varying sizes. Integrated transport systems move PCBs efficiently between potting, curing, and inspection modules. Adjustable parameters accommodate different glue viscosities and potting patterns. The system reduces material waste, improves production reliability, and ensures repeatable quality. Compact inline design allows easy integration with existing SMT and DIP lines. Operators can quickly switch programs to accommodate different PCB layouts or product models.
The GP800 uses programmable nozzles with controlled flow rates to apply glue accurately to designated areas. Adjustable stroke lengths, speeds, and nozzle angles allow complex patterns and dense component coverage. Height sensors ensure uniform coating thickness. The automated system prevents over- or under-filling, guaranteeing consistent potting quality for single- or double-sided PCBs.
A modular conveyor system transports PCBs between dispensing, curing, and inspection stations. Stepper motor drives provide precise positioning. Pushers and buffers stabilize boards during glue application. Quick-release fixtures allow rapid changeover between product types. The design maintains accurate alignment, prevents PCB misplacement, and ensures high-speed operation in inline SMT/DIP workflows.
Integrated IR or UV curing modules rapidly cure glue without affecting component integrity. Inspection stations with CCD or laser sensors check coverage uniformity and detect errors in real time. PLC-based control allows operators to adjust curing time, conveyor speed, and inspection parameters. Continuous monitoring ensures consistent quality while maximizing throughput and minimizing downtime.
Application:
| Model | I.C.T GP800 |
| Nozzle Number | 1(Multiple head is option) |
| Axis Number | 3-Axis X,Y,Z |
| Table Size | <500*500mm |
| Z-axis Adjustment | 0-100mm |
| Cleaning | Auto |
| Gluing material | Silicone,epoxy.PU,etc. |
| Glue viscosity | <20000 |
| Power Supply | AC:220±10%,50/60HZ, 2.5Kw |
| Control Method | PLC+Touch screen |
| Dimension(mm) | L1800*W1800*H1500 |
| Weight | Approx:580kg |
I.C.T provides full support for SMT, DIP, and potting operations. Pre-delivery planning assesses PCB type, potting material, production targets, and layout. Post-delivery, engineers handle installation, commissioning, operator training, maintenance, and process optimization. Integration of glue potting, curing, handling, and inspection ensures a reliable workflow. New facilities receive step-by-step guidance from layout to trial production, while existing lines gain optimized processes and stable operation.
| Product Name | Purpose in PCBA Coating Line |
|---|---|
Applies precise protective coatings to circuit boards for dustproof, waterproof, and explosion-proof protection. | |
Hardens coatings with IR or UV light, ensuring durable and strong protection. | |
Transports circuit boards smoothly through the coating line for efficient processing. | |
Provides and stores PCB for the production line, ensuring smooth input and output. | |
| Conformal coating AOI | Inspects coating quality and detects defects to ensure high standards. |
In December 2025, I.C.T delivered three integrated lines—SMT, DIP, and coating—to an automotive electronics client in Saudi Arabia. I.C.T engineers handled on-site installation, calibration, and operator training. The client had previously inspected I.C.T’s facility in June 2025. After successful commissioning, engineers received certificates of honor recognizing their professionalism and the reliability of the complete SMT, DIP, and Glue Potting line solution for a new ODM factory capable of independent R&D, design, and production.
I.C.T provides full support for SMT, DIP, and potting operations. Pre-delivery planning assesses PCB type, potting material, production targets, and layout. Post-delivery, engineers handle installation, commissioning, operator training, maintenance, and process optimization. Integration of glue potting, curing, handling, and inspection ensures a reliable workflow. New facilities receive step-by-step guidance from layout to trial production, while existing lines gain optimized processes and stable operation.
Clients praise I.C.T for hands-on guidance and quick response. Engineers provide clear instructions to reduce errors and improve production efficiency. Packaging ensures safe transport of equipment. Technical questions are handled promptly. Customers trust I.C.T for launching new SMT, DIP, and potting lines, achieving consistent, high-quality potting results in offline or inline production.
The GP800 Glue Potting Line is CE and ISO9001 certified. Quality procedures include component inspection, assembly verification, functional testing, packing review, shipment tracking, installation, and after-sales service. These standards ensure reproducible, reliable potting performance across single- and double-sided PCBA assemblies, including automotive, smartphone, and LED applications.
I.C.T delivers turnkey solutions for SMT, DIP, coating, dispensing, assembly, and smart factory integration. In-house R&D, production, engineering, sales, and service teams support clients worldwide. Projects include supply, installation, training, and process optimization. I.C.T builds new factories from 0 to 1 and upgrades existing lines from 1 to 10, providing precise, scalable, and reliable PCBA potting and coating solutions.