Hidden solder joint defects are a leading cause of field failures in high-reliability electronics. Traditional AOI, ICT, and manual inspection cannot detect voids, bridging, HiP, or poor wetting. Only high-resolution X-ray inspection—including 2D, 2.5D, and 3D CT—can reliably identify these critical issues. ICT’s X-7100, X-7900, and X-9200 systems deliver sub-micron resolution, intelligent software, and global support, helping manufacturers in automotive, medical, aerospace, and 5G sectors reduce failures, improve reliability, and achieve rapid ROI.