| Precision Vacuum Convection Reflow Solution
The Vacuum BGA reflow oven is designed for high-reliability SMT soldering processes, especially for BGA and complex PCB assemblies. It combines convection heating with vacuum technology to improve solder joint quality and reduce internal voids. This system is widely used in advanced SMT reflow oven PCB oven production environments where stability and precision are critical.
The machine integrates a pump and chiller system to maintain stable vacuum pressure and controlled thermal balance during soldering. With intelligent PLC control and optimized airflow design, it ensures consistent temperature distribution and strong process repeatability. It is suitable for high-performance electronics manufacturing requiring reliable solder reflow in oven processes across mass production lines.
| Feature
The vacuum zone removes trapped gas during peak solder melting, reducing void formation inside BGA joints. The integrated pump system ensures stable pressure control throughout the process. This improves electrical conductivity and mechanical strength, making it suitable for high-end SMT reflow oven PCB oven production with strict quality requirements.
The heating system uses advanced convection airflow to ensure uniform temperature across all PCB areas. Multi-zone control maintains stable thermal curves and prevents overheating or uneven soldering. This improves consistency in SMT convection reflow oven SMT applications and supports complex board structures with high component density.
The operator system uses a simple PLC + PC interface for full process control. Users can easily adjust vacuum levels, temperature profiles, and cooling parameters. Recipe storage, real-time monitoring, and fault alerts improve production efficiency and reduce operator errors in solder reflow in oven manufacturing environments.
| Specification
| LV Series Vacuum Reflow Oven | I.C.T-LV623 | I.C.T-LV733 |
Dimensions | L6405*W1695*H1630 | L7164*W1695*H1630 |
Weight | 3000 kg | 3500 kg |
| Number of heating zone | Top 8 /Bottom 8 | Top 10 /Bottom 0 |
| Length of heating zone | 3110mm | 3892mm |
| Number of cooling zone | Top 3 /Bottom 3 | Top 3 /Bottom 3 |
| Exhaust volume requiement | 11m³/min*2 | 12m³/min*2 |
| Power | 3phase, N,PE;AC380V50/60HZ | |
| Normal power consumption | 10KW | 12KW |
| Temperature control Mode | PID close loop cont+SSR driving | |
| Conveyor system | ||
| Rails structure | Three-stage independent | |
| Max width of PCB | 150*150MM-400*400MM | |
| Range of rail width | 50mm-400mm | |
| Components height | Up 25mm/down 25mm | |
| Conveyor fixed type | Front end fixing | |
| PCB conveyor direction | Guide rail plus chain | |
| Conveyor height | 900±20mm | |
| Cooling system | ||
| Cooling method | Forced air cooling (vacuum reflow soldering) Chiller cooling (vacuum nitrogen reflow soldering) | |
| Nitrogen System | Nitrogen confined structures and pipelines, nitrogen flow meters, chillers | |
As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here. | ||
* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice. If different, please follow the new list.
| SMT Line Equipment List
Our SMT assembly line features advanced equipment for efficient and precise PCB assembly. The fully automated SMT line includes a loader, an auto printer for accurate solder paste application, a pick-and-place machine for precise component placement, a reflow oven for reliable soldering, and an AOI system for thorough defect inspection. This High Quality PCBA Production Line ensures smooth operation, high reliability, and low-cost SMT assembly, meeting diverse industry requirements.
| Product Name | Purpose in SMT Line |
|---|---|
| PCB loader unloader | Automatically loads bare PCBs to the line. |
| SMT stencil printing machine | Prints solder paste on PCB pads accurately. |
| Yamaha SMT machine | Mounts components onto PCBs precisely. |
| SMT Reflow Oven | Melts solder to form solid joints. |
| Automated optical inspection equipment | Inspects solder joints and placement defects. |
| Solder paste inspection machine | Checks solder paste height and quality. |
| Traceability Equipment | Records and tracks production data: Laser Marking Machine/Label Mounter/Inkjet Printer |
| Customer Success Video
I.C.T provided a full SMT and DIP production solution for a large electronics factory in Uzbekistan. The customer manufactures computer motherboards, SSD storage devices, and memory modules with high production demand.
The SMT line included stencil printing equipment, four placement machines, SPI, AOI systems, PCB handling systems, and reflow oven units. The DIP line included manual insertion systems, JUKI odd-form insertion machines, and wave soldering systems.
I.C.T engineers supported full installation, debugging, and production training. After system commissioning, the customer confirmed stable operation, strong equipment reliability, and excellent technical support performance.
| Global Full-Line Support
I.C.T provides complete technical support for Vacuum BGA reflow oven systems, including installation, process training, and production optimization. Engineers assist both on-site and remotely to ensure smooth factory startup and stable SMT production performance.
Training covers temperature profile setup, vacuum operation control, maintenance procedures, and troubleshooting methods. This helps operators manage SMT reflow oven PCB oven systems efficiently and reduce production downtime.
| Customer Praise
Customers recognize I.C.T equipment for stable performance, high soldering quality, and reliable long-term operation. The Vacuum BGA reflow oven is especially praised for its consistent void reduction results and easy operation interface.
Customers also highlight fast technical response, professional installation service, and secure packaging during shipment. These advantages help factories maintain stable SMT production and improve overall manufacturing efficiency.
| Our Certification
The Vacuum BGA reflow oven is manufactured under strict international standards including CE, RoHS, ISO9001, and patented SMT process technologies. These certifications ensure safe operation, stable performance, and global compliance.
Each machine undergoes strict factory testing before delivery to guarantee reliability in high-demand SMT production environments worldwide.
| About I.C.T and Factory
I.C.T is a global provider of SMT and electronics manufacturing solutions with strong R&D, production, and engineering service capabilities. The company serves customers in more than 80 countries worldwide.
With advanced manufacturing systems and experienced engineering teams, I.C.T delivers complete SMT, DIP, and coating production line solutions. Our strict quality control ensures stable equipment performance and long-term reliability for global electronics manufacturing industries.