| Industrial-Level Vacuum Reflow Process Solution
Industrial Vacuum Reflow Soldering Equipment is developed for manufacturers requiring stable soldering quality under complex PCB assembly conditions. Instead of focusing only on heat delivery, the system manages both temperature behavior and vacuum pressure interaction during solder melting, ensuring better structural reliability.
The equipment is widely used in SMT vacuum solder reflow oven and vacuum Reflow Soldering Oven Machine environments where production stability is more important than single-cycle optimization. Its continuous conveyor design allows smooth PCB movement through each process stage, making it suitable for high-volume electronics manufacturing lines requiring consistent solder performance.
| Feature
The vacuum zone operates during the critical solder transition stage when gases are most likely to be trapped inside molten joints. By applying controlled pressure reduction, internal void formation is minimized without disturbing PCB positioning. This improves long-term reliability in SMT vacuum reflow oven production, especially for dense BGA and multi-layer boards where internal defects are difficult to detect after assembly.
The heating system is designed around energy balancing rather than simple temperature increase. Multiple thermal zones distribute heat gradually across different PCB regions, preventing localized overheating. This approach supports stable reflow behavior in SMT Vacuum Solder Reflow Oven environments, ensuring consistent solder flow across mixed-component layouts and reducing process variation between production batches.
The operator system functions as a process control layer where production parameters are managed as structured recipes instead of manual adjustments. Vacuum timing, conveyor speed, and heating curves are combined into unified process profiles. This reduces operator dependency and improves repeatability in vacuum reflow soldering oven machine operations, ensuring stable results across different shifts and production conditions.
| Specification
| LV Series Vacuum Reflow Oven | I.C.T-LV623 | I.C.T-LV733 |
Dimensions | L6405*W1695*H1630 | L7164*W1695*H1630 |
Weight | 3000 kg | 3500 kg |
| Number of heating zone | Top 8 /Bottom 8 | Top 10 /Bottom 0 |
| Length of heating zone | 3110mm | 3892mm |
| Number of cooling zone | Top 3 /Bottom 3 | Top 3 /Bottom 3 |
| Exhaust volume requiement | 11m³/min*2 | 12m³/min*2 |
| Power | 3phase, N,PE;AC380V50/60HZ | |
| Normal power consumption | 10KW | 12KW |
| Temperature control Mode | PID close loop cont+SSR driving | |
| Conveyor system | ||
| Rails structure | Three-stage independent | |
| Max width of PCB | 150*150MM-400*400MM | |
| Range of rail width | 50mm-400mm | |
| Components height | Up 25mm/down 25mm | |
| Conveyor fixed type | Front end fixing | |
| PCB conveyor direction | Guide rail plus chain | |
| Conveyor height | 900±20mm | |
| Cooling system | ||
| Cooling method | Forced air cooling (vacuum reflow soldering) Chiller cooling (vacuum nitrogen reflow soldering) | |
| Nitrogen System | Nitrogen confined structures and pipelines, nitrogen flow meters, chillers | |
As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here. | ||
* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice. If different, please follow the new list.
| SMT Line Equipment List
Our SMT assembly line features advanced equipment for efficient and precise PCB assembly. The fully automated SMT line includes a loader, an auto printer for accurate solder paste application, a pick-and-place machine for precise component placement, a reflow oven for reliable soldering, and an AOI system for thorough defect inspection. This High Quality PCBA Production Line ensures smooth operation, high reliability, and low-cost SMT assembly, meeting diverse industry requirements.
| Product Name | Purpose in SMT Line |
|---|---|
| PCB loader unloader | Automatically loads bare PCBs to the line. |
| SMT stencil printing machine | Prints solder paste on PCB pads accurately. |
| Yamaha SMT machine | Mounts components onto PCBs precisely. |
| SMT Reflow Oven | Melts solder to form solid joints. |
| Automated optical inspection equipment | Inspects solder joints and placement defects. |
| Solder paste inspection machine | Checks solder paste height and quality. |
| Traceability Equipment | Records and tracks production data: Laser Marking Machine/Label Mounter/Inkjet Printer |
| Customer Success Video
A large-scale electronics manufacturing facility in Uzbekistan implemented a complete SMT and DIP production solution for motherboard, SSD, and memory module production. The project included full system integration from equipment installation to production validation.
The SMT line consisted of printing equipment, multiple placement machines, inspection systems, PCB handling systems, and reflow processing equipment. The DIP line included manual insertion systems, odd-form insertion machines, and wave soldering systems.
I.C.T engineers provided full technical support during installation, debugging, and production ramp-up. After commissioning, the customer confirmed stable system operation and consistent production output across all manufacturing stages.
| Global Full-Line Support
Production-focused engineering assistance
Technical support is structured around real production requirements rather than isolated machine operation. Engineers assist customers in optimizing process parameters, stabilizing vacuum behavior, and improving thermal consistency across production batches.
Training programs focus on practical SMT production scenarios, helping operators understand how vacuum, heat, and conveyor interaction influence final solder quality. This improves operational stability in SMT vacuum solder reflow oven environments and reduces process variation.
| Customer Praise
Stable performance in continuous production environments
Users report strong consistency in long-term production cycles, especially in maintaining stable solder quality during extended operation periods. Once process parameters are established, equipment behavior remains stable across different production shifts.
Engineering support responsiveness and installation quality are frequently highlighted, particularly during early production ramp-up stages where process tuning is most critical.
| Our Certification
Global manufacturing compliance assurance
Industrial Vacuum Reflow Soldering Equipment is manufactured under internationally recognized standards including CE, RoHS, ISO9001, and SMT-related process certifications.
Each unit undergoes strict factory-level testing before shipment to ensure stable performance in vacuum reflow soldering oven machine production environments worldwide.
| About I.C.T and Factory
Global SMT manufacturing solution provider
I.C.T focuses on complete SMT equipment development and integrated production line solutions for global electronics manufacturers. The company supports customers across multiple industries including consumer electronics, automotive systems, and industrial control.
With strong engineering capability and manufacturing experience, I.C.T delivers stable SMT, DIP, and coating production systems designed for long-term reliability and scalable factory production worldwide.