Publish Time: 2026-02-09 Origin: Site
In February 2026, I.C.T sent its SMT engineering team to Uzbekistan to provide on-site technical support for a customer manufacturing PC motherboards using a fully integrated Hanwha SMT + DIP production line. The visit began on February 7 and focused on process optimization, production stabilization, and practical training for the customer’s local team, helping ensure reliable and efficient motherboard production.
The customer installed a complete SMT and through-hole solution integrated by I.C.T, designed for stable, high-volume computer motherboard assembly, where placement precision, soldering quality, and inspection accuracy are essential.
The SMT line is powered by fourHanwha Pick and Place Machines – DECAN S1, delivering high-speed and high-precision placement for a wide range of motherboard components, including fine-pitch ICs and chip components. During the on-site visit, I.C.T engineers optimized feeder setup, placement programs, and machine calibration, improving placement stability and overall production efficiency.
To ensure printing quality, the line uses a high-precision SPI (Solder Paste Inspection) system, which detects printing defects such as insufficient paste, offset, or height variation before placement. After reflow soldering, an AOI (Automated Optical Inspection) system inspects solder joints and component placement across the motherboard, improving defect detection and strengthening quality control.
A high-precision SMT stencil printer ensures consistent solder paste deposition, forming the foundation of stable motherboard assembly. Engineers optimized printing parameters during the visit, improving print consistency.
The line is equipped with a 10 reflow oven I.C.T- Lyra 733 for controlled thermal processing and stable solder joint formation. I.C.T engineers performed thermal profiling and optimized the temperature curve based on motherboard structure and solder paste characteristics, improving solder quality and process stability.
The production line also includes a complete DIP solution for through-hole components such as connectors and power devices used in PC motherboards.
A JUKI insertion machine automates through-hole component insertion, improving consistency and efficiency. The wave soldering machine ensures reliable soldering of these components. During the visit, I.C.T engineers optimized insertion and soldering parameters, resulting in stable operation and clean solder joints.
In addition to equipment optimization, I.C.T engineers provided hands-on training covering machine operation, maintenance, inspection, and process control. After improvements, the production line showed better placement stability, improved inspection accuracy, and more consistent soldering quality, helping reduce defects and maintain stable production.
This Uzbekistan project reflects I.C.T’s commitment to providing complete production solutions and long-term technical support. With reliable equipment and practical engineering expertise, I.C.T continues to help customers achieve stable and efficient PC motherboard manufacturing, ensuring smooth and consistent production performance.