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As a global intelligent equipment provider, I.C.T has continued to provide intelligent electronic equipment for global customers since 2012. 
You are here: Home » Our Company » Company Currents » I.C.T Launches New R10 Reflow Oven for Large PCB Boards

I.C.T Launches New R10 Reflow Oven for Large PCB Boards

Publish Time: 2026-04-14     Origin: Site

As electronic products continue to evolve toward larger sizes and more complex structures, manufacturers are facing increasing challenges in thermal processing and soldering consistency. To address these demands, I.C.T officially introduces the new R10 Reflow Oven, designed specifically for large-size PCB assemblies and high-profile components.

The I.C.T R10 reflow oven is built to deliver stable and reliable soldering performance under more demanding production conditions. Compared with the previous L8 model, the R10 brings a series of structural and performance upgrades, making it a more suitable solution for industries such as LED lighting, power electronics, automotive electronics, and industrial control systems.

To better understand the structure and performance of the I.C.T R10 reflow oven, watch the video below:

At the core of the R10 design is its enhanced mechanical structure. The wider rail system, reaching approximately 500 mm, allows smooth handling of larger PCBs and supports lateral transfer during production. Meanwhile, the increased rail clearance of about 200 mm provides sufficient space for taller components, effectively reducing the risk of compression or damage during the reflow process.

In addition to structural improvements, the R10 is equipped with a stronger transport system. With a load capacity of up to 60 kg, it ensures stable conveying even for heavy and densely populated boards. This is particularly important for large modules or multi-layer PCB assemblies where stability directly impacts soldering quality.

Thermal performance is another key highlight of the R10. The machine features a 10-zone heating design combined with thicker heating wires, enabling more precise and consistent temperature control across the entire reflow process. This helps maintain uniform heat distribution, reduces thermal deviation, and ensures reliable solder joints across different board sizes and component types.

Overall, the I.C.T R10 reflow oven is developed to meet the growing demand for large PCB production while maintaining high efficiency and consistent quality. It reflects I.C.T’s continuous focus on practical manufacturing challenges and its commitment to providing reliable SMT solutions for global customers.

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