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You are here: Home » News & Events » News » What is the application prospect and development direction of Lyra Reflow Oven?

What is the application prospect and development direction of Lyra Reflow Oven?

Publish Time: 2022-05-09     Origin: Site

Today, with the rapid development of the electronic field, reflow soldering technology has become an important technology to promote the development of the electronic field. With the development of society, more and more people begin to pay attention to reflow soldering technology, and Lyra Reflow Oven technology is applied in our lives. There are also many fields, so only by understanding the principles of Lyra Reflow Oventechnology can we better understand the presence of Lyra Reflow Oven technology in those fields.



This is the content list:

l  Introduction to the technical application principle of Lyra Reflow Oven.

l  What method is used to realize the application of Lyra Reflow Oven?

l  What is the application prospect and development direction of Lyra Reflow Oven?






Introduction to the technical application principle of Lyra Reflow Oven.

Lyra Reflow Oven technology is actually a fine process welding technology. The biggest advantage of this technology is that it can weld electronic components to the circuit board on some small circuit boards, so as to meet the needs of enterprises for circuit boards. As early as the early 1980s, the electronic field still used the most common common soldering to solder electronic components to circuit boards.




What method is used to realize the application of Lyra Reflow Oven?

When ordinary soldering cannot be soldered on a small circuit board, the emergence of reflow soldering technology makes this problem easy to solve. The Lyra Reflow Oven technology achieves the purpose of soldering by heating the air to a certain temperature, the electronic components that have been attached to the circuit board will be naturally soldered on the circuit board. The emergence of Lyra Reflow Oven technology allows small circuit boards to achieve the purpose of soldering components, thereby promoting the development of the electronic field.


Several methods have been found to realize Lyra Reflow Oven: one is to stick the first component with glue, then when it is turned over and enters the reflow soldering for the second time, the component will be fixed in position without falling. This method is very common, but requires additional equipment and operating steps, which increases the cost. The second is to use solder alloys with different melting points. For the first side, a higher melting point alloy is used and for the second side, a low melting point alloy is used. The problem with this method is that the choice of low melting point alloy may be affected by the final product. The operating temperature is limited, and the alloy with high melting point is bound to increase the temperature of the Lyra Reflow Oven, which may cause damage to the components and the PCB itself.




What is the application prospect and development direction of Lyra Reflow Oven?

MostLyra Reflow Oven furnaces currently in use are of forced hot air circulation type, and it is not easy to control nitrogen consumption in such furnaces. There are several ways to reduce the consumption of nitrogen and reduce the opening area of the inlet and outlet of the Lyra Reflow Oven. The important point is to use partitions, roller blinds or similar devices to block the unused part of the inlet and outlet space. Another way is to use the principle that the hot nitrogen layer is lighter than air and not easy to mix. When designing the Lyra Reflow Oven furnace, the heating chamber is higher than the inlet and outlet, so that a natural nitrogen layer is formed in the heating chamber, which reduces the amount of nitrogen. The amount of compensation is maintained at the required degree.




Today, with the rapid development of science and technology, Lyra Reflow Oven technology is applied in many fields, whether it is life or work, Lyra Reflow Oven technology can be seen everywhere. For example, the internal components such as computers and TVs that are usually used are all soldered by reflow soldering technology, so that there are parts such as motherboards and circuit boards to assemble computers and TVs. In addition to the fields mentioned above, there are also many places where Lyra Reflow Oven technology is applied in some medical, scientific research and other fields. With the continuous progress and development of the electronic field, Lyra Reflow Oven, technology will become an important technology in the electronic field, providing the backbone for the advancement of science and technology!


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