SMT Assembly Line Configuration
The general SMT assembly line process includes three steps: solder paste printer, pick and place machine and reflow oven. The pick and place is the primary core equipment: it is used to realize high-speed, high-precision, fully automatic placement of components, which is related to the efficiency and accuracy of the SMD assembly line. It is the most critical and complicated equipment. In many devices, the placement machine often accounts for more than 70% of the investment in the entire production line, so the choice of the placement machine is very important.
The SMT stencil printer has two options: semi-automatic and full-automatic. Semi-automatic cannot be connected with other SMT equipment and requires human intervention (such as SMT conveyor), but the structure is simple and the price is much cheaper than the fully automatic. Fully automatic printing machine with high degree of automation and high efficiency is suitable for large-scale production.
Reflow oven is developing efficiently, multifunctionality and intelligently. Among them are reflow furnaces with unique multi-jet airflow control, SMT reflow oven with nitrogen protection, reflow furnaces with local forced cooling, and component temperature monitoring. Reflow ovens, reflow ovens with dual conveyors, reflow ovens with center support, etc. In addition to the above-mentioned new PCB reflow oven, intelligent reflow furnaces have also appeared. The adjustment operation is controlled by a built-in computer. In a window operating environment, various data can be easily entered using the keyboard or light pen, and can be quickly accessed from Take out or replace the reflow soldering process curve in the memory, saving adjustment time and improving production efficiency.
❙ SMT Assembly Line Video