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I.C.T-LV733 | LV Series Vacuum Reflow Oven Machine

I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various
welding processes.
PCB Width: L500 - W400mm
Quantity of cooling zones: 3(top 3/bottom 3)
  • I.C.T-LV733

  • I.C.T

Availability:
Quantity:

I.C.T-LV733 | LV Series Vacuum Reflow Oven Machine


Introduction:

I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various soldering processes, LV Series Vacuum Reflow Oven is high-end reflow products committed to keeping up with market demand to enhance customers competitiveness.Its new design concept fully meets the needs of increasingly diverse processes, And considering the future direction of the industry, entirely suitable for communications, automotive electronics, home appliances, computers and other consumer electronic products .


Vacuum reflow oven

Features:

1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be

more than 99.99%.

2.Vacuum system:PCB directly enters the vacuum unit from soldering area. Start the vacuum process to reduce the vacuum pressure to

100mbar-5mbar. The internal gas such as pores and cavities overflows from the molten solder joint, which can reduce the void rate to less

than 2%.

3.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat.The

effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± 1 ℃ ambient

temperature to a temperature stabilization .

4.Monitoring Software:Windows interface, traditional and simplified Chinese and English online free switch, and operator password

management, easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault

self-diagnosis, process monitoring, automatic generate and save process control documents, substrate transport dynamic display.


Product:

Vacuum Reflow Oven


From zero to 240 °C due to optimized heat transfer


Each product has its own requirements in the manufacturing process. Optimized heat transfer over the entire soldering process is the basis for

best possible results.

The LV-Series offers flexibly controllable preheating zones within which your PCB is preheated and prepared for the actual soldering process.

The individual zones can be controlled independently of each other via fan frequency, and assure best possible processes.

The LV-Series is equipped with special nozzle sheets for optimized heat transfer by means of uniform air flow over the PCBs. Flow speeds in the

upper and lower heat zones can be separately controlled, assuring that your PCB is heated up.


Saddle profile Vacuum reflow oven

Saddle profile

The component is brought to a temperature of at least 240 °C for soldering. Using a saddle profile the board is gradually heated in line with pre-defined, individual temperature ranges. Even components with differing thermal masses are heated homogeneously and temperature differences minimised.

Linear profile Vacuum reflow oven

Linear profile

With a linear profile, the component is not heated in a stepped manner during soldering, in fact it is heated along an identical linear temperature gradient. Linear profiles can reduce cycle times and can help to reduce soldering errors such as tombstoning.


vacuum reflow oven Heating System

Heating System


<Separately adjustable heating zones

<Reproducible temperature profile

<Outstanding process stability with the smallest possible ΔT

<Homogenous heat input over the entire PCB thanks to specially designed nozzles

<Low maintenance effort


Specification:


LV Series Vacuum Reflow Oven

I.C.T-LV733

I.C.T-LV733N

DIMENSIONS AND WEIGHTS

Dimensions

6300*1430*1530mm

Required area

9.45㎡

Weight

ca. 2500 kg

ca. 2800 kg

Load per unit area 400 kg/m2

400 kg/m2

PROCESS CHAMBER HEATING

Length of heating zones

3730mm

Quantity of preheating zones

9

Length of preheating zones

3450mm

Quantity of peak zones

1

Warm up time

ca. 30 min

VACUUM ZONE

Vacuum maximum pressure

0.1-12kpa

Vacuum pump flow

1000/min

Pressure relief time

≦10S

Product time

≧40S

COOLING ZONE

Quantity of cooling zones

3[top 3(Water cooling)/bottom 3(Air cooling)]

Length of cooling zones

1460mm

CONVEYOR

Transport Level

900 ±20 mm

PCB Size

L320 - W400mm

Conveyor control

3-stage, independent control

Conveyor Number

1

Adjustable conveyor speed

300 - 1800 mm/min
INTERFACES

Type

SMEMA

Voltage supply

5-Wire System 3P,N,PE 380 VAC ± 5 % 50 Hz 

Other voltages upon request

Connected load

68KW

Operating capacity

16 KW

As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here.

I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice.

FAQ:


Q: What Is a Vacuum Reflow Oven Machine in SMT?

A: A Vacuum Reflow Oven Machine is a specialized equipment used in Surface Mount Technology (SMT) for soldering electronic components onto printed circuit boards (PCBs). It creates a controlled environment with reduced oxygen levels to prevent solder oxidation during the soldering process.


Q: How Does a Vacuum Reflow Oven Work?

A: A Vacuum Reflow Oven works by lowering the atmospheric pressure inside the chamber, reducing oxygen levels. This prevents solder oxidation and enhances the quality of solder joints during the reflow soldering process, especially for sensitive or critical components.


Q:: What Are the Advantages of Using a Vacuum Reflow Oven in SMT?

A: The advantages of using a Vacuum Reflow Oven in SMT include reduced solder defects, improved solder joint quality, enhanced reliability for critical components, and the ability to handle lead-free and sensitive materials effectively.


Q:: When Should You Consider Using a Vacuum Reflow Oven Machine?

A: Consider using a Vacuum Reflow Oven when soldering delicate or sensitive components, high-reliability applications, or assemblies that require precise control over solder joint quality. It's a valuable tool for achieving superior soldering results in demanding SMT manufacturing scenarios.



I.C.T - Our Company


Vacuum Reflow Oven Machine

About I.C.T: 


I.C.T is a leading provider of factory planning solution. We have 3 wholly-owned factories, providing professional consultation and services for global customers. We have more than 22 years of eletronic overall solutions. We not only provide a complete set of equipment, but also provide full range of technical support and services, and give customers more reasonable professional advice. We help many customersv to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are to set up factories in LED, TV, mobile phone, DVB, EMS and other indutries all over the world. We are trustworthy.

Reflow Soldering Oven


Exhibition


SMD Reflow Soldering Oven

For SMT Factory Setup, We Can Do for You:

1.  We Provide Full SMT Solution for You

2.  We Provide Core Technology With Our Equipments

3.  We Provide The Most Professional Tech Service

4.  We Have Wealthy Experience on SMT Factory Setup

5.  We Can Solve Any Question About SMT


vacuum reflow oven


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